com.mobius.software.telco.protocols.diameter.VendorIDs Maven / Gradle / Ivy

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package com.mobius.software.telco.protocols.diameter;
/*
 * Mobius Software LTD, Open Source Cloud Communications
 * Copyright 2023, Mobius Software LTD and individual contributors
 * by the @authors tag.
 *
 * This program is free software: you can redistribute it and/or modify
 * under the terms of the GNU Affero General Public License as
 * published by the Free Software Foundation; either version 3 of
 * the License, or (at your option) any later version.
 *
 * This program is distributed in the hope that it will be useful,
 * but WITHOUT ANY WARRANTY; without even the implied warranty of
 * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
 * GNU Affero General Public License for more details.
 *
 * You should have received a copy of the GNU Affero General Public License
 * along with this program.  If not, see 
 */

/**
*
* @author yulian oifa
*
*/

public class VendorIDs
{
	public static final long HP_ID = 11;
	public static final long SUN_ID = 42;
	public static final long MERIT_ID = 61;
	public static final long ERICSSON_ID = 193;
	public static final long US_ROBOTICS_ID = 429;
	public static final long TGPP2_ID = 5535;
	public static final long TGPP_ID = 10415;
	public static final long VODAFONE_ID = 12645;
	public static final long ETSI_ID = 13019;
	public static final long CABLE_LABS_ID = 4491;
	public static final long HUAWEI_ID = 2011;	
	public static final long ONEM2M_ID = 45687;	
}